*****A*****
Abietic Acid松脂酸.
Abrasion Resistance耐磨性.
Abrasives磨料,刷材.
ABS树脂.
Absorption吸收(入).
Ac Impedance交流阻抗.
Accelerated Test(Aging)加速老化(试验).
Acceleration速化反应.
Accelerator 加速剂,速化剂.
Acceptability,Acceptance 允收性,允收.
Access Hole露出孔,穿露孔.
Accuracy准确度.
Acid Number (Acid Value)酸值.
Acoustic Microscope (AM)感音成像显微镜.
Acrylic压克力(聚丙烯酸树脂).
Actinic Light (or Intensity, or Radiation)有效光.
Activation活化.
Activator活化剂.
Active Carbon活性炭.
Active Parts(Devices)主动零件.
Acutance解像锐利度.
Addition Agent添加剂.
Additive Process加成法.
Adhesion附着力.
Adhesion Promotor附着力促进剂.
Adhesive胶类或接着剂.
Admittance导纳(阻抗的倒数).
Aerosol喷雾剂,气熔胶,气悬体.
Aging老化.
Air Inclusion气泡夹杂.
Air Knife风刀.
Algorithm算法.
Aliphatic Solvent脂肪族溶剂.
Aluminium Nitride(AlN)氮化铝.
Ambient Tamp环境温度.
Amorphous无定形,非晶形.
Amp-Hour安培小时.
Analog Circuit/Analog Signal模拟电路/模拟讯号.
Anchoring Spurs着力爪.
Angle of  Contack接触角.
Angle of Attack攻角.
Anion阴离子.
Anisotropic异向性,单向的.
Anneal 韧化(退火).
Annular Ring孔环.
Anode阳极.
Anode Sludge阳极泥.
Anodizing阳极化.
ANSI美国标准协会.
Anti-Foaming Agent消泡剂.
Anti-pit Agent抗凹剂.
AOI自动光学检验.
Apertures开口,钢版开口.
AQL品质允收水准.
AQL(Acceptable Quality Level)允收品质水准.
Aramid Fiber聚醯胺纤维.
Arc Resistance耐电弧性.
Array排列.
Artwork底片.
ASIC特定用途绩体电路器.
Aspect Ratio纵横比.
Assembly组装装配.
A-stage A阶段.
ATE自动电测设备.
Attenuation讯号衰减.
Autoclave压力锅.
Axial-lead轴心引脚.
Azeotrope共沸混合液.
                       *****B*****
Back Light (Back Lighting)背光法.
Back Taper反锥斜角.
Backpanels, Backplanes支撑板.
Back-up 垫板.
Balanced Transmission Lines平衡式传输线.
Ball Grid Array球脚数组(封装).
Bandability弯曲性.
Banking Agent护岸剂.
Bare Chip Assembly裸体芯片组装.
Barrel孔壁,滚镀.
Base Material基材.
Basic Grid基本方格.
Batch批.
Baume波美度(凡液体比重比水重则  Be=145-(145÷Sp.Gr)
凡液体比重比水轻则  Be=140÷(Sp.Gr-130)
*Sp.Gr 为比重即同体绩物质对"纯水"1g/cm的比值).
Beam lead光芒式的平行密集引脚.
Bed-of-Nail Testing针床测试.
Bellows Conact弹片式接触.
Beta Ray Backscatter贝他射线反弹散射.
Bevelling切斜边.
Bias斜张纲布,斜纤法.
Bi-Level Stencil]双阶式钢板.
Binder粘结剂.
Bits头(Drill Bits).
Black Oxide黑氧化层.
Blanking冲空断开.
Bleack 漂洗.
Bleeding溢流.
Blind Via Hole肓通孔.
Blister局部性分层或起泡.
Block Diagram电路系统块图 .
Blockout封纲.
Blotting干印.
Blotting Paper吸水纸.
Blow Hole吹孔.
Blue Plaque蓝纹(锡面钝化层).
Blur Edge (Circle)模糊边带(圈).
Bomb Sight弹标.
Bond Strength结合强度.
Bondability结合性.
Bonding Layer结合层接着层.
Bonding Sheet(Layer)接合片.
Bonding Wire结合线.
Bow, Bowing板弯.
Braid编线.
Brazing硬焊(用含银的铜锌合金焊条).
在425℃~870℃下进行熔接的方式).
Break Point显像点.
Break-away Panel可断开板.
Breakdown Voltage崩溃电压.
Break-out破出.
Bridging搭桥.
Bright Dip光泽浸渍处理.
Brightener光泽剂.
Brown Oxide棕氧化.
Brush Plating刷镀.
B-stageB阶段.
Build Up Process增层法制程.
Build-up堆积.
Bulge鼓起.
Bump 突块.
Bumping Process凸块制程.
Buoyancy浮力.
Buried Via Hole埋导孔.
Burn-in高温加速老化试验.
Burning烧焦.
Burr毛头.
Bus Bar汇电杆.
Butter Coat 外表树脂层.
                        *****C*****
C4 Chip JointC4芯片焊接.
Cable电缆.
CAD计算机辅助设计.
Calendered Fabric轧平式纲布.
Cap Lamination帽式压合法.
Capacitance电容.
Capacitive Coupling电容耦合.
Capillary Action毛细作用.
Carbide碳化物.
Carbon Arc Lamp碳弧灯.
Carbon Treatment, Active活化炭处理.
Card卡板.
Card Cages/Card Racks电路板构装箱.
Carlson Pin卡氏定位稍.
Carrier载体.
Cartridge滤心.
Castallation堡型绩体电路器.
Catalyzed Board, Catalyzed Substrate催化板材.
Catalyzing催化.
Cathode阴极.
Cation阴向离子, 阳离子.
Caul Plate隔板.
Cavitation空泡化  半真空.
Center-to-Center Spacing中心间距.
Ceramics陶瓷.
Cermet陶金粉.
Certificate证明书.
CFC氟氢碳化物.
Chamfer倒角.
Characteristic Impedance特性阻抗.
Chase纲框.
Check List检查清单.
Chelate螯合.
Chemical Milling化学研磨.
Chemical Resistance抗化性.
Chemisorption化学吸附.
Chip芯片(粒).
Chip Interconnection芯片互连.
Chip on Board芯片粘着板.
Chip On Glass晶玻接装(COG).
Chisel钻针的尖部.
Chlorinated Solvent含氯溶剂,氯化溶剂.
Circumferential Separation环状断孔.
Clad/Cladding披覆.
Clean Room无尘室.
Cleanliness清洁度.
Clearance余地,余环.
Clinched Lead Terminal紧箝式引脚.
Clinched-wire Through Connection通孔弯线连接法 .
Clip Terminal绕线端接.
Coat, Coating皮膜表层.
Coaxial Cable同轴缆线.
Coefficient of Thermal Expansion热膨胀系数.
Co-Firing共绕.
Cold Flow冷流.
Cold Solder Joint冷焊点.
Collimated Light平行光.
Colloid胶体.
Columnar Structure柱状组织.
Comb Pattern梳型电路.
Complex Ion错离子.
Component Hole零件孔.
Component Orientation零件方向.
Component Side组件面.
Composites,(CEM-1,CEM-3)复合板材.
Condensation Soldering凝热焊接,液化放热焊接.
Conditioning整孔.
Conductance导电.
Conductive Salt导电盐.
Conductivity导电度.
Conductor Spacing导体间距.
Conformal Coating贴护层.
Conformity吻合性, 服贴性.
Connector连接器.
Contact Angle接触角.
Contact Area接触区.
Contact Resistance接触电阻.
Continuity连通性.
Contract Service协力厂,分包厂.
Controlled Depth Drilling定深钻孔.
Conversion Coating 转化皮膜.
Coplanarity共面性.
Copolymer共聚物.
Copper Foil铜皮.
Copper Mirror Test铜镜试验.
Copper Paste铜膏.
Copper-Invar-Copper (CIC)综合夹心板.
Core Material内层板材,核材.
Corner Crack 通孔断角.
Corner Mark板角标记.
Counterboring方型扩孔.
Countersinking锥型扩孔.
Coupling Agent 偶合剂.
Coupon, Test Coupon板边试样.
Coverlay/Covercoat表护层.
Crack裂痕.
Crazing白斑.
Crease皱折.
Creep潜变.
Crossection Area截面积.
Crosshatch Testing十字割痕试验.
Crosshatching十字交叉区.
Crosslinking, Crosslinkage交联,架桥.
Crossover越交,搭交.
Crosstalk噪声, 串讯.
Crystalline Melting Point晶体熔点.
C-Stage C阶段.
Cure硬化,熟化.
Current Density电流密度.
Current-Carrying Capability载流能力.
Curtain Coating濂涂法.
                        *****D*****
Daisy Chained Design菊瓣设计.
Datum Reference基准参考.
Daughter Board子板.
Debris碎屑,残材.
Deburring去毛头.
Declination Angle斜射角.
Definition边缘逼真度.
Degradation 劣化.
Degrasing脱脂.
Deionized Water去离子水.
Delamination分离.
Dendritic Growth 枝状生长.
Denier丹尼尔(是编织纺织所用各种纱类直径单位,
定义9000米纱束所具有的重量(以克米计)).
Densitomer透光度计.
Dent凹陷.
Deposition 皮膜处理.
Desiccator干燥器.
Desmearing去胶渣.
Desoldering解焊.
Developer显像液,显像机.
Developing显像 .
Deviation偏差.
Device电子组件.
Dewetting缩锡.
D-glassD玻璃.
Diaze Film偶氮棕片.
Dichromate重铬 酸盐.
Dicing芯片分割.
Dicyandiamide(Dicy)双氰胺.
Die 冲模.
Die Attach晶粒安装.
Die Bonding晶粒接着.
Die Stamping冲压.
Dielectric 介质.
Dielectric Breakdown Voltage介质崩溃电压.
Dielectric Constant介质常数.
Dielectric Strength介质强度.
Differential Scanning Calorimetry(DSC)微差扫瞄热卡分析法.
Diffusion Layer扩散层.
Digitizing数字化.
Dihedral Angle双反斜角.
Dimensional Stability尺度安定性.
Diode二极管.
Dip Coating浸涂法.
Dip Soldering浸焊法.
DIP(Dual Inline Package)双排脚封装体.
Dipole偶极,双极.
Direct / Indirect Stencil直接/间接版膜.
Direct Emulsion直接乳胶.
Direct Plating直接电镀.
Discrete Compenent散装零件.
Discrete Wiring Board散线电路板,复线板.
Dish Down碟型下陷.
Dispersant分散剂.
Dissipation Factor散失因素.
Disspation Factor散逸因子.
Disturbed Joint受扰焊点.
Doctor Blade修平刀,刮平刀.
Dog Ear狗耳.
Doping掺杂.
Double Layer双电层.
Double Treated Foil双面处理铜箔.
Drag In / Drag Out带[进/带出.
Drag Soldering拖焊.
Drawbridging吊桥效应.
Drift漂移.
Drill Facet钻尖切削面.
Drill Pointer钻针重磨机.
Drilled Blank已钻孔的裸板.
Dross浮渣.
Drum Side铜箔光面.
Dry Film干膜.
Dual Wave Soldering 双波焊接.
Ductility展性.
Dummy Land假焊垫.
Dummy, Dummying假镀(片).
Durometer橡胶硬度计.
DYCOstrate电浆蚀孔增层法.
Dynamic Flex(FPC)动态软板.
                        *****E*****
E-Beam (Electron Beam)电子束.
Eddy Current涡电流.
Edge Spacing板边空地.
Edge-Board Connector板边(金手指)承接器.
Edge-Board Contact板边金手指.
Edge-Dip Solderability Test板边焊锡性测试.
EDTA乙二胺四乙酸.
Effluent排放物.
E-glass电子级玻璃.
Elastomer弹性体.
Electric Strength(耐)电性强度.
Electrodeposition电镀.
Electro-deposition Photoresist电着光阻, 电泳光阻.
Electroforming电铸.
Electroless-Deposition无电镀.
Electrolytic Tough Pitch电解铜..
Electrolytic-Cleaning电解清洗.
Electro-migration电迁移.
Electro-phoresis电泳动, 电渗.
Electro-tinning镀锡.
Electro-Winning电解冶炼.
Elongation 延伸性, 延伸率.
Embossing凸出性压花.
EMF(Electromotive Force)电动势.
EMI(Electromagnetic Interference)电磁干扰.
Emulsion乳化.
Emulsion Side药膜面.
Encapsulating胶囊.
Encroachment沾污,侵犯.
End Tap封头.
Entek有机护铜处理.
Entrapment夹杂物.
Entry Material盖板.
Epoxy Resin环氧树脂.
Etch Factor蚀刻因子.
Etchant蚀刻剂(液).
Etchback回蚀.
Etching Indicator蚀刻指针.
Etching Resist蚀刻阻剂.
Eutetic Composition共融组成.
Exotherm放热(曲线).
Exposure曝光.
Eyelet铆眼.
                        *****F*****
Fabric纲布.
Face Bonding反面朝下结合.
Failure故障.
Fan Out Wiring/Fan In Wiring扇出布线/扇入布线.
Farad 法拉.
Farady法拉第.
Fatigue Strength抗疲劳强度.
Fault缺陷.
Fault Plane断层面.
Feed Through Hole导通孔.
Feeder 进料器.
Fiber Exposure玻纤显露.
Fiducial Mark基准记号.
Filament纤丝.
Fill纬向.
Filler填充料.
Fillet内圆填角.
Film底片.
Film Adhesive接着膜,粘合膜.
Filter过滤器.
Fine Line细线.
Fine Pitch密脚距,密线距,密垫距.
Fineness粒度, 纯度.
Finger手指.
Finishing终修(饰).
Finite Element Method有限要素分析法.
First Article首产品.
First Pass-Yield初检良品率.
Fixture夹具.
Flair刃角变形.
Flame Point自燃点.
Flame Resistant耐燃性.
Flammability Rate燃性等级.
Flare扇形崩口.
Flash Plating闪镀.
Flashover闪络.
Flat Cable扁平排线.
Flat Pack扁平封装(之零件).
Flatness平坦度.
Flexible Printed Circuit (FPC)软板.
Flexural Failure挠曲损坏.
Flexural Module弯曲模数, 抗挠性模数 .
Flexural Strength抗挠强度.
Flip Chip覆晶,扣晶.
Flocculation絮凝.
Flood Stroke Print覆墨冲程印刷.
Flow Soldering (Wave Soldering)流焊.
Fluorescence荧光.
Flurocarbon Resin碳氟树脂.
Flush Conductor嵌入式线路  , 贴平式 导体.
Flush Point闪火点.
Flute退屑槽.
Flux助焊剂.
Foil Burr铜箔毛边.
Foil Lamination铜箔压板法.
Foot残足(干膜残余物).
Foot Print (Land Pattern)脚垫.
Foreign Material 外来物,异物.
Form-to-List布线说明清单.
Four Point Twisting四点扭曲法.
Free Radical自由基.
Freeboard干舷.
Frequency频率.
Frit 玻璃熔料.
Fully-Additive Process全加成法.
Fungus Resistance抗霉性.
Fused Coating熔锡层.
Fusing熔合.
Fusing Fluid助熔液.
                        *****G*****
G-10由连续玻纤所织成的玻纤布与
环氧树脂粘结剂所复合成的材料.
Gage, Gauge量规.
Gallium Arsenide (GaAs)砷化镓.
Galvanic Corrosion贾凡尼式腐蚀(电解式腐蚀).
Galvanic Series贾凡尼次序(电动次序).
Galvanizing镀锌.
GAP第一面分离,长刃断开.
Gate Array闸列,闸极数组.
Gel Time胶化时间.
Gelation Particle胶凝点.
Gerber Data ,Gerber File格博档案(是美商Gerber公司专为PCB面线路
图形与孔位,所发展一系列完整的软件档案).
Ghost Image阴影.
Gilding镀金 (现为:Glod Plating).
Glass Fiber玻纤.
Glass Fiber Protrusion/Gouging, Groove玻纤突出/挖破.
Glass Transition Temperature, Tg玻璃态转化温度.
Glaze釉面,釉料.
Glob Top圆顶封装体.
Glouble Test球状测试法.
Glycol (Ethylene Glycol)乙二醇.
Golden Board测试用标准板.
Grain Size结晶粒度.
Grass Leak 大漏.
Grid标准格.
Ground Plane /Earth Plane接地层.
Ground Plane Clearance接地空环.
Guide Pin导针.
Gull /Wing Lead鸥翼引脚.
                        *****H*****
Halation环晕.
Half Angle半角.
Halide卤化物.
Haloing白圈,白边.
Halon海龙,是CFC"氟碳化物"的一种商品名.
Hard Anodizing硬阳极化.
Hard Chrome Plating镀硬铬.
Hard Soldering硬焊.
Hardener (Curing Agent)硬化剂(或Curing Agent).
Hardness硬度.
Haring-Blum Cell海固槽.
Harness电缆组合.
Hay Wire跳线.
Heat Cleaning烧洁.
Heat Dissipation散热.
Heat Distortion Point (Temp)热变形点(温度).
Heat Sealing热封.
Heat Sink Plane散热层.
Heat Transfer Paste导热膏.
Heatsink Tool散热工具.
Hertz(Hz)赫.
High Efficiency Particulate Air Filter (HEPA)高效空气尘粒过泸机.
Hipot Test 高压电测.
Hi-Rel高度靠度.
Hit 击(钻孔时钻针每一次"刺下"的动作).
Holding Time停置时间.
Hole Breakout孔位破出.
Hole Counter数孔机.
Hole Density孔数密度.
Hole Preparation通孔准备.
Hole Pull Strength孔壁强度.
Hole Void破洞.
Hook 切削刀缘外凸.
Hot Air Levelling喷锡.
Hot Bar Soldering热把焊接.
Hot Gas Soldering热风手焊.
HTE(High Temperature Elongation)高温延伸性.
Hull Cell哈氏槽.
Hybrid Integrated Circuit混成电路.
Hydraulic Bulge Test液压鼓起试验.
Hydrogen Embrittlement氢脆.
Hydrogen Overvoltage氢过(超)电压.
Hydrolysis水解.
Hydrophilic亲水性.
Hygroscopic吸湿性.
Hypersorption超吸咐.
                         *****I*****
I.C. Socket绩体电路器插座.
Icicle锡尖.
Illuminance照度.
Image Transfer影像转移.
Immersion Plating浸镀.
Impedance阻抗.
Impedance Match阻抗匹配.
Impregnate含浸.
In-Circuit Testing组装板电测.
Inclusion异物,夹杂物.
Indexing Hole基准孔.
Inductance(L)电感.
Infrared(IR)红外线.
Input/Output输入/输出.
Insert, Insertion插接.
Inspection Overlay套检底片.
Insulation Resistance绝缘电阻.
Integrated Circuit(IC)绩体电路器.
Inter Face接口.
Interconnection互连.
Intermetallic Compound (IMC)接口共化物.
Internal Stress内应力.
Interposer互边导电物.
Interstitial Via-Hole(IVH)局部层间导通孔.
Invar殷钢(63.8%Fe,36%Ni,0.2%C).
Ion Cleanliness离子清洁度.
Ion Exchange Resins离子交换树脂.
Ion Migration离子迁移.
Ionizable (Ionic) Contaimination离子性污染.
Ionization游离,电离.
Ionization Voltage (Corona Level)电离化电压(电缆内部狭缝空气中,引起其
电离所施加之最小电压).
IPC美国印刷电路板协会.
Isolation隔离性,隔绝性.
                         *****J*****
JEDEC(Joint Electronic Device  联合电子组件工程委员会.
Engineering Council)
J-LeadJ型接脚.
Job Shop专业工厂.
Joule焦耳.
Jumper Wire跳线.
Junction接(合)面,接头.
Just-In-Time(JIT)适时供应,及时出现.
                        *****K*****
Kapton聚亚醯胺软板.
Karat克拉    (1克拉(钻石)=0.2g   纯金则24k金为
100%的钝金.
Kauri-Butanol Value考立丁醇值(简称K.B.值).
Kerf.切形,裁剪.
Kevlar聚醯胺纤维.
Key电键
Key Board键盘.
Kiss Pressure吻压, 低压.
Knoop Hardness努普硬度.
Known Good Die(KGD)已知之良好芯片.
Kovar科伐合金(Fe53%,Ni29%,Co17%).
Kraft Paper牛皮纸.
                        *****L*****
Lamda Wave延伸平波.
Laminar Flow平流.
Laminar Structure片状结构.
Laminate Void板材空洞.
Laminate(s)基板.
Lamination Void压合空洞.
Laminator压膜机.
Land孔环焊垫,表面焊垫.
Landless Hole无环通孔.
Laser Direct Imaging (LDI)雷射直接成像.
Laser Maching雷射加工法.
Laser Photogenerator(LPG), Laser Photoplotter雷射曝光机.
Laser Soldering雷射焊接法.
Lay Back 刃角磨损.
Lay Out布线,布局.
Lay Up 叠合.
Layer to Layer Spacing层间距离
Leaching焊散漂出,熔出.
Lead 引脚.
Lead Frame脚架.
Lead Pitch脚距.
Leakage Current漏电电流.
Legend文字标记.
Leveling整平.
Lifted Land孔环(焊垫)浮起.
Ligand错离子附属体.
Light Emitting Diodes (LED)发光二极管.
Light Integrator光能累积器.
Light Intensity光强度.
Limiting Current Density极限电流密度.
Liquid Crystal Display (LCD)液晶显示器.
Liquid Dielectrics液态介质.
Liquid Photoimagible Solder Mask, (LPSM)液态感光防焊绿漆.
Local Area Network区域性网络.
Logic 逻辑.
Logic Circuit 逻辑电路.
Loss Factor损失因素.
Loss Tangent (TanδDK)损失正切.
Lot Size批量.
Luminance发光强度.
Lyophilic亲水性胶体.
                       *****M*****
Macro-Throwing Power巨观分布力.
Major Defect主要(严重)缺点.
Major Weave Direction主要织向.
Margin刃带(钻头尖部).
Marking标记.
Mask阻剂.
Mass Finishing大量整面(拋光).
Mass Lamination大型压板.
Mass Transport质量输送.
Master Drawing主图.
Mat席(用于CEM-3(Composite Epoxy Material)的
复合材料.)
Matte Side毛面(电镀铜皮(ED Foil)之粗糙面).
Mealing泡点.
Mean Time To Failure (MTTF)故障前可用之平均时数.
Measling白点.
Mechanical Stretcher机械式张网机.
Mechanical Warp机械式缠绕.
Mechanism机理.
Membrane Switch薄膜开关.
Meniscograph Test弧面状沾锡试验.
Meniscus弯月面.
Mercury Vaper Lamp汞气灯.
Mesh Count纲目数.
Metal Halide Lamp 金属卤素灯.
Metallization金属 化.
Metallized Fabric金属化纲布.
Micelle微胞.
Micro Wire Board微封线板.
Micro-electronios微电子.
Microetching微蚀.
Microsectioning微切片法.
Microstrip 微条.
Microstrip Line微条线,微带线.
Microthrowing Power微分布力.
Microwave微波.
Migration迁移.
Migration Rate迁移率.
Mil英丝.
Minimum Annular Ring孔环下限.
Minimum Electrical Spacing电性间距下限.
Minor Weave Direction次要织向.
Misregistration 对不准度.
Mixed Componmt Mounting Technology混合零件之组装技术.
Modem调变及解调器.
Modification修改.
Module模块.
Modulus of Elasticity弹性系数.
Moisture and Insulation Resistance Test湿气与绝缘电阻试验.
Mold Release 脱模剂,离型剂.
Mole摩尔.
Monofilament单丝.
Mother Board主机板,母板.
Moulded Circuit模造立体电路机.
Mounting Hole安装孔.
Mounting Hole组装孔,机装孔.
Mouse Bite鼠齿(蚀刻后线路边缘出现不规则缺口).
Multi-Chip-Module(MCM)多芯片芯片模块.
Multiwiring Board (or Discrete Wiring Board)复线板.
                        *****N*****
N.C.数值控制.
Nail Head钉头.
Near IR近红外线.
Negative负片,钻尖的第一面外缘变窄.
Negative Etch-back反回蚀.
Negative Stencil负性感光膜.
Negative-Acting Resist负性作用之阻剂.
Network纲状元件.
Newton牛顿.
Newton Ring 牛顿环.
Newtonian Liquid牛顿流体.
Nick缺口.
N-Methyl Pyrrolidine (NMP)N-甲基四氢哔咯.
Noble Metal Paste贵金属印膏.
Node节点.
Nodule节瘤.
Nomencleature标示文字符号.
Nominal Cured Thickness标示厚度.
Non-Circular Land非圆形孔环焊垫.
Non-flammable非燃性.
Non-wetting不沾锡.
Normal Concentration  (Strength)标准浓度,当量浓度.
Normal Distribution常态分布.
Novolac酯醛树脂.
Nucleation , Nucleating核化.
Numerical Control数值控制.
Nylon尼龙.
                        *****O*****
Occlusion吸藏.
Off-Contact架空.
Offset第一面大小不均.
OFHC(Oxyen Free High Conductivity)无氧高导电铜.
Ohm欧姆.
Oilcanning盖板弹动.
OLB(Outer Lead Bond)外引脚结合.
Oligomer寡聚物.
Omega Meter离子污染检测仪.
Omega Wave振荡波.
On-Contact Printing密贴式印刷.
Opaquer不透明剂,遮光剂.
Open Circuits断线.
Optical Comparater光学对比器(光学放大器.)
Optical Density光密度.
Optical Inspection光学检验.
Optical Instrument光学仪器.
Organic Solderability Preservatives (OSP)有机保焊剂.
Osmosis渗透.
Outgassing出气,吹气.
Outgrowth悬出,横出,侧出.
Output产出,输出.
Overflow溢流.
Overhang总悬空.
Overlap 钻尖点分离.
Overpotantial(Over voltage)过电位,过电压.
Oxidation氧化.
Oxygen Inhibitor氧化抑制剂.
Ozone Depletion臭氧层耗损.
                         *****P*****
Packaging封装,构装.
Pad焊垫,圆垫.
Pad Master圆垫底片.
Pads Only Board唯垫板.
Palladium钯.
Panel制程板.
Panel Plating全板镀铜.
Panel Process全板电镀法.
Paper Phenolic纸质酚醛树脂(板材).
Parting Agent脱膜剂.
Passivation钝化 ,钝化外理.
Passive Device (Component)被动组件(零件)
Paste膏,糊.
Pattern板面图形.
Pattern Plating线路电镀.
Pattern Process线路电镀法.
Peak Voltage峰值电压.
Peel Strength抗撕强度.
Periodic Reverse (PR) Current周期性反电流.
Peripheral周边附属设备.
Permeability透气性,导磁率.
Permittivity诱电率,透电率.
pH Value酸碱值.
Phase相.
Phase Diagram相图.
Phenolic酚醛树脂.
Photofugitive感光褪色.
Photographic film感光成像之底片.
Photoinitiator感光启始剂.
Photomask光罩.
Photoplotter, Plotter光学绘图机.
Photoresist光阻.
Photoresist Chemical Machinning (Milling)光阻式化学(铣刻)加工.
Phototool底片.
Pick and  Place拾取与放置.
Piezoelectric压电性.
Pin 插脚,插梢,插针.
Pin Grid Array (PGA)矩阵式针脚对装.
Pinhole针孔.
Pink Ring粉红圈.
Pitch跨距,脚距,垫距,线距.
Pits凹点.
Plain Weave平织.
Plasma电浆.
Plasticizers可塑剂,增塑剂.
Plated Through Hole镀通孔.
Platen热盘.
Plating镀.
Plotting标绘.
Plowing犁沟.
Plug插脚,塞柱.
Ply层,股.
Pneumatic Stretcher气动拉伸器.
Pogo Pin伸缩探针.
Point 钻尖.
Point Angle钻尖面.
Point Source Light点状光源.
Poise泊."粘滞度"单位=1dyne*sec/cm2.
Polar Solvent极性溶剂.
Polarity电极性.
Polarization分极,极化.
Polarizing Slot偏槽.
Polyester Films聚酯类薄片.
Polymer Thick Film (PTF)厚膜糊.
Polymerization聚合.
Polymide(PI)聚亚醯胺.
Popcorn Effect爆米花效应.
Porcelain瓷材,瓷面.
Porosity Test疏孔度试验.
Positive Acting Resist正性光阻剂.
Post Cure后续硬化,后烤.
Post Separation后期分离,事后公离.
Pot Life运用期,锅中寿命.
Potting铸封,模封.
Power Supply电源供应器.
Preform 预制品.
Preheat预热.
Prepreg胶片,树脂片.
Press Plate钢板.
Press-Fit Contact挤入式接触.
Pressure Foot 压力脚.
Pre-tinning预先沾锡.
Primary Image线路成像.
Print Through压透,过度挤压..
Probe探针.
Process Camera制程用照像机.
Process Window操作范围.
Production Master生产底片.
Profile轮廓,部面图,升温曲线图棱线.
Propagation传播.
Propagation Delay传播延迟.
Puddle Effect水坑效应.
Pull Away拉离.
Pulse Plating脉冲电镀法.
Pumice Powder 浮石粉.
Punch冲切.
Purge, Purging净空,净洗.
Purple Plague紫疫(金与铝的共化物层).
Pyrolysis热裂解,高温分解.
                        *****Q*****
Quad Flat Pack (QFP)方扁形封装体.
Qualification Agency资格认证机构.
Qualification Inspection资格检验.
Qualified Products List合格产品(供应者)名单.
Qualitative Analysis定性分析.
Quality Conformance Test Circuitry (Coupon)品质符合之试验线路(样板).
Quantitative Analysis定量分析.
Quench 淬火,骤冷.
Quick Disconnect快速接头.
Quill纬纱绕轴.
                        *****R*****
Rack 挂架.
Radial Lead放射状引脚.
Radio Frequency Interference (RFI)射频干扰.
Rake Angle抠角,耙角.
Rated Temperature, Voltage额定温度,额定电压.
Reactance电抗.
Real Estate底材面,基板面.
Real Time System 实时系统.
Reclaiming再生,再制.
Rediometer辐射计,光度计.
Reel to Reel卷轮(盘)式操作.
Reference Dimension参考尺度.
Reference Edge参考边缘.
Reflection反射.
Reflow Soldering重熔焊接,熔焊.
Refraction折射.
Refractive Index折射率.
Register Mark对准用标记.
Registration对准度.
Reinforcement补强物.
Rejection剔退,拒收.
Relamination(Re-Lam)多层板压合.
Relaxation松弛.缓和.
Relay继电器.
Release Agent,  Release Sheets脱模剂,离模剂.
Reliability可靠度,可信度.
Relief Angle浮角.
Repair修理.
Resin Coated Copper Foil背胶铜箔.
Resin Content胶含量,树脂含量.
Resin Flow胶流量,树脂流量.
Resin Recession树脂下陷.
Resin Rich Area 多胶区,树脂丰富区.
Resin Smear胶(糊)渣.
Resin Starve Area缺胶区,树脂缺乏区.
Resist阻膜,阻剂.
Resistivity电阻系数,电阻率.
Resistor电阻器,电阻.
Resistor Drift电阻漂移.
Resistor Paste电阻印膏.
Resolution解像,解像度,分辨率.
Resolving Power解析(像)力,分辨力.
Reverse Current Cleaning反电流(电解)清洗.
Reverse Etchback反回蚀.
Reverse Image负片影像(阻剂).
Reverse Osmosis (RO)反(逆渗透).
Reversion反转,还原.
Revision修正版.改订版.
Rework(ing)重工,再加工.
Rhology流变学,流变性质.
Ribbon Cable圆线缆带.
Rigid-Flex Printed Board硬软合板.
Ring 套环.
Rinsing水洗,冲洗.
Ripple纹波(指整流器所输出电流中不稳定成分).
Rise Time上升时间.
Roadmap 线路与零件之布局图.
Robber辅助阴极.
Roller Coating辊轮涂布.
Roller Coating滚动涂布法.
Roller Cutter辊切机.
Roller Tinning辊锡法,滚锡法.
Rosin松香.
Rotary Dip Test摆动沾锡试验.
Routing切外型.
Runout偏转,累绩距差.
Rupture迸裂.
                         *****S*****
Sacrificial Protection牺牲性保护层.
Salt Spray Test盐雾试验.
Sand Blast喷砂.
Saponification皂化作用.
Saponifier皂化剂.
Satin Finish缎面处理.
Scaled Flow Test比例流量实验.
Schemetic Diagram电路概略图.
ScoringV型刻槽.
Scratch刮痕.
Screen Printing纲版印刷.
Screenability纲印能力.
Scrubber磨刷机,磨刷器.
Scum透明残膜.
Sealing封孔.
Secondary Side第二面 .
Seeding下种.
Selective Plating选择性电镀.
Self-Extinguishing自熄性.
Selvage布边.
Semi-Additive Process半加成制程.
Semi-Conductor半导体.
Sensitizing敏化.
Separable Component Part可分离式零件.
Separator Plate隔板, 钢板.
Sequential Lamination接续性压合法.
Sequestering Agent螯合剂.
Shadowing阴影,回蚀死角.
Shank钻针柄部.
Shear Strength 抗剪强度.
Shelf Life储龄.
Shield遮蔽.
Shore Hardness萧氏硬度.
Short短路.
Shoulder Angle肩斜角.
Shunt分路.
Side Wall侧壁.
Siemens电阻值.
Sigma (Standard Deviation)标准差.
Signal讯号.
Silane硅烷.
Silica Gel硅胶砂.
Silicon硅.
Silicone硅铜.
Silk Screen纲版印刷,丝纲印刷.
Silver Migration银迁移.
Silver Paste 银膏.
Single-In-Line Package(SIP)单边插脚封装体.
Sintering烧结.
Sizing上胶,上浆.
Sizing上浆处理.
Skin  Effect集肤效应 (高频下,电流在传递时多集中在导体
   表面,使得道线内部通过电流甚少, 造成内部导体
浪费,并也使得表面导体部分电阻升高.
Skip Printing, Skip Plating漏印,漏镀.
Skip Solder 缺锡, 漏焊.
Slashing浆经.
Sleeve Jint套接.
Sliver边丝,边余.
Slot, Slotting槽口.
Sludge于泥.
Slump塌散.
Slurry稠浆,悬浮浆.
Small Hole小孔.
Smear胶渣.
Smudging锡点沾污.
Snap-off弹回高度.
Socket插座.
Soft Contact轻触.
Soft Glass 软质玻璃(铅玻璃).
Solder焊锡.
Solder Ball锡球.
Solder Bridging锡桥.
Solder Bump 焊锡凸块.
Solder Column Package锡柱脚封装法.
Solder Connection焊接.
Solder Cost焊锡着层.
Solder Dam锡堤.
Solder Fillet填锡.
Solder Levelling喷锡,热风整平.
Solder Masking(S/M)防焊膜绿漆.
Solder Paste锡膏.
Solder Plug锡塞(柱).
Solder Preforms预焊料.
Solder Projection焊锡突点.
Solder Sag 焊锡垂流物.
Solder Side焊锡面.
Solder Spatter溅锡.
Solder Splash贱锡.
Solder Spread Test散锡试验.
Solder Webbing锡纲.
Solder Webbing锡纲.
Solder Wicking渗锡,焊锡之灯芯效应.
Solderability可焊性.
Soldering软焊,焊接.
Soldering Fluid, Soldering Oil助焊液,护焊油.
Solid Content固体含量,固形分.
Solidus Line固相线.
Spacing间距.
Span跨距.
Spark Over闪络.
Specific Heat 比热.
Specification (Spec)规范,规格.
Specimen样品,试样.
Spectrophotometry分光光度计检测法.
Spindle主轴,钻轴.
Spinning Coating自转涂布.
Splay斜钻孔.
Spray Coating喷着涂装.
Spur底片图形边缘突出.
Sputtering溅射.
Squeege刮刀.
Stagger Grid蹒跚格点.
Stalagometer滴管式表面张力计.
Stand-off Terminals直立型端子.
Starvation缺胶.
Static Eliminator静电消除器.
Steel Rule Die(钢)刀模.
Stencil版膜.
Step and Repeat逐次重复曝光.
Step Plating梯阶式镀层.
Step Tablet阶段式曝光表.
Stiffener补强条(板).
Stop Off防镀膜, 阻剂.
Strain变形,应变.
Strand绞(指由许多股单丝集束并旋扭而成的丝束).
Stray Current迷走电流, 散杂电流(在电镀槽系统中,其直流电
  由整流器所提供,应在阳极板与被镀件之间的汇
电杆与槽体液体中流通,但有时少部分电流也可能会
从槽体本身或加热器上迷走,漏失).
Stress Corrosion应力腐蚀.
Stress Relief消除应力.
Strike预镀.
Stringing拖尾.
Stripline条线.
Stripper剥除液(器).
Substractive Process减成法.
Substrate底材.
Supper Solder超级焊锡.
Supported Hole(金属)支助通孔.
Surface Energy表面能.
Surface Insulation Resistance表面绝缘电阻.
Surface Mount Device 表面粘装组件.
Surface Mounting Technology (SMT)表面粘装技术.
Surface Resistivity表面电阻率.
Surface Speed钻针表面速度.
Surface Tension表面张力.
Surfactant表面润湿剂.
Surge突流,突压.
Swaged Lead压扁式引脚.
Swelling Agents, Sweller膨松剂.
Swimming 线路滑离.
Synthetic Resin合成树脂.
                        *****T*****
Tab接点,金手指.
Taber Abraser泰伯磨试器.
Tackiness粘着性, 粘手性.
Tape Automatic Bonding (TAB)卷带自动结合.
Tape Casting 带状铸材.
Tape Test撕胶带试验.
Tape Up Master原始手贴片.
Taped Components卷带式连载组件.
Taper Pin Gauge锥状孔规.
Tarnish污化.
Tarnish 污化, 污着.
Teflon铁氟龙(聚4氟乙烯).
Telegraphing浮印,隐印.
Temperature Profile温度曲线.
Template模板.
Tensile Strength抗拉强度.
Tensiomenter张力计.
Tenting盖孔法.
Terminal端子.
Terminal Clearance端子空环.
Tetra-Etch氟树脂蚀粗剂.
Tetrafunctional Resin四功能树脂.
Thermal Coefficient of Expansion (TCE)热膨胀系数.
Thermal Conductivity导热率.
Thermal Cycling热循环,热震荡.
Thermal Mismstch感热失谐.
Thermal Relief散热式镂空.
Thermal Via导热孔.
Thermal Zone感热区.
Thermocompression Bonding热压结合.
Thermocouple热电偶.
Thermode发热体.
Thermode Soldering热模焊接法.
Thermogravimetric Analysis, (TGA)热重分析法.
Thermomechanical Analysis (TMA)热机分析法.
Thermoplastic热塑性.
Thermosetting热固性.
Thermosonic Bonding热超音波结合.
Thermount聚醯胺短纤席材.
Thermo-Via导热孔.
Thick Film Circuit厚膜电路.
Thief辅助阳极.
Thin Copper Foil薄铜箔.
Thin Core薄基板.
Thin Film Technology薄膜技术.
Thin Small Outline Package(TSOP)薄小型绩体电路器.
Thinner调薄剂.
Thixotropy抗垂流性,摇变性.
Three Point Bending三点压弯试验.
Three-Layer Carrier三层式载体.
Threshold Limit Value (TLV)极限值.
Through Hole Mounting通孔插装.
Through Put物流量,物料通过量.
Throwing Power分布力.
Tie Bar分流条.
Tin Drift锡量漂飘失.
Tin Immersion浸镀锡.
Tin Pest锡疫(常见白色金属锡为"β锡",当温度低于13.2℃
时则β锡将逐渐转变成粉末状灰色"α锡"称为"锡疫".
Tin Whishers锡须.
Tinning热沾焊锡.
Tolerance公差.
Tombstoning墓碑效应.
Tooling Feature工具标示物.
Topography表面地形.
Torsion Strength抗扭强度.
Touch Up触修,简修.
Trace 线路,导线.
Traceability追溯性,可溯性.
Transducer转能器.
Transfer Bump移用式突块.
Transfer Laminatied Circuit转压式线路.
Transfer Soldering移焊法.
Transistor晶体管.
Translucency半透性.
Transmission Line传输线.
Transmittance透光率.
Treament, Treating含浸处理.
Treeing枝状镀物,镀须.
Trim修整, 精修.
Trim Line裁切线.
Trimming修整,修边.
True Position真位.
Tungsten钨
Tungsten Carbide碳化钨.
Turnkey System包办式系统.
Turret Solder Terminal塔立式焊接端子.
Twill Weave斜织法.
Twist板扭.
Two Layer Carrier两层式载体.
                        *****U*****
UL Symbol(UL.为Under-Writers 保俭业试验所标志.
    Laboratories,INC)
Ultimate Tensile Strength (UTS)极限抗拉强度.
Ultra High Frequency (UHF)超高频率.
Ultra Violet Curing (UV Curing)紫外线硬化.
Ultrasonic Bonding超音波结合.
Ultrasonic Cleaning超音波清洗.
Ultrasonic Soldering超音波焊接.
Unbalanced Transmission Line非平衡式传输线.
Undercut, Undercutting侧蚀.
Underplate底镀层.
Universal Tester汛用型电测机.
Unsupported Hole非镀通孔.
Urea尿素.
Urethane胺基甲酸乙脂.
                        *****V*****
Vacuoles焊洞.
Vacuum Evaporation(or Deposition)真空蒸镀法.
Vacuum Lamination真空压合.
Van Der Waals Force凡得华力.
Vapor Blasting蒸汽喷砂.
Vapor Degreasing蒸汽除油法.
Vapor Phase Soldering气相焊接.
Varnish凡力水,清漆(树脂之液态单体).
V-cutV型切槽.
Very Large-Scale Integration(VLSI)极大绩体电路器.
Via Hole 导通孔.
Vickers Hardness维氏硬度.
Viscosity粘滞度,粘度.
Vision Systems视觉系统.
Visual Examination目视检验.
Void 破洞,空洞.
Volatile Content挥发份含量.
Voltage电压.
Voltage Breakdown崩溃电压.
Voltage Drop 电压降落.
Voltage Efficiency电压效率.
Voltage Plane电压层.
Voltage Plane Clearance电压层的空环.
Volume Resistivity体绩电阻率.
Volume Resistivity体绩电阻率.
Volumetric Analysis容量分析法.
Vulcanization交联,硫化.
                        *****W*****
Wafer晶圆.
Waive暂准过关,暂不检查.
Warp Size 浆经处理.
Warp, Warpage板弯.
Washer垫圈.
Waste Treatment废弃处理.
Water Absorption吸水性.
Water Break水膜破散,水破.
Water Mark水印.
Watt瓦特.
Watts Bath瓦兹镀镍液.
Wave Guide导波管.
Wave Soldering波焊.
Waviness 波纹,波度.
Wear Resistance耐磨性,耐磨度.
Weatherability耐候性.
Weave Eposure织纹显露.
Weave Texture织纹隐现.
Web蹼部.
Wedge Bond 楔形结合点.
Wedge Void楔形缺口(破口).
Weft Yarn纬纱.
Welding熔接.
Wet Blasting湿喷砂.
Wet Lamination湿压膜法.
Wet Process湿式制程.
Wetting Agent润湿剂.
Wetting Balance沾锡天平.
Wetting Balance沾锡,沾湿.
Whirl Brush旋涡式磨刷法.
Whirl Coating旋涡涂布法.
Whisker晶须.
White Residue白色残渣.
White Spot白点.
Wicking灯蕊效应.
Window操作范围,传动齿孔.
Wiping Action 滑动接触(导电).
Wire Bonding打线结合.
Wire Gauge线规.
Wire Lead金属线脚.
Wire Pattern布线图形.
Wire Wrap绕线互连.
Working Master工作母片.
Working Time (Life)堪用时间.
Workmanship 手艺,工艺水平,制作水准.
Woven Cable扁平编线.
Wrinkle皱折, 皱纹.
Wrought Foil锻碾金属箔.
                        *****X*****
X AxisX轴.
X-Ray X光.
X-Ray FluorescenceX萤光.
                        *****Y*****
Yarn纱线.
Y-AxisY轴.
Yield良品率,良率,产率.
Yield Point屈服点.
                         *****Z*****
Z-AxisZ轴.
Zero Centering中心不变(叠合法).
Zig-Zag In-Line Package (ZIP)炼齿状双排脚封装件.

=====================================================
[分享]PCB专业英译术语
一、 综合词汇
1、 印制电路：printed circuit
2、 印制线路：printed wiring
3、 印制板：printed board
4、 印制板电路：printed circuit board (PCB)
5、 印制线路板：printed wiring board(PWB)
6、 印制组件：printed component
7、 印制接点：printed contact
8、 印制板装配：printed board assembly
9、 板：board
10、 单面印制板：single-sided printed board(SSB)
11、 双面印制板：double-sided printed board(DSB)
12、 多层印制板：mulitlayer printed board(MLB)
13、 多层印制电路板：mulitlayer printed circuit board
14、 多层印制线路板：mulitlayer prited wiring board
15、 刚性印制板：rigid printed board
16、 刚性单面印制板：rigid single-sided printed borad
17、 刚性双面印制板：rigid double-sided printed borad
18、 刚性多层印制板：rigid multilayer printed board
19、 挠性多层印制板：flexible multilayer printed board
20、 挠性印制板：flexible printed board
21、 挠性单面印制板：flexible single-sided printed board
22、 挠性双面印制板：flexible double-sided printed board
23、 挠性印制电路：flexible printed circuit (FPC)
24、 挠性印制线路：flexible printed wiring
25、 刚性印制板：flex-rigid printed board, rigid-flex printed board
26、 刚性双面印制板：flex-rigid double-sided printed board, rigid-flex double-sided printed
27、 刚性多层印制板：flex-rigid multilayer printed board, rigid-flex multilayer printed board
28、 齐平印制板：flush printed board
29、 金属芯印制板：metal core printed board
30、 金属基印制板：metal base printed board
31、 多重布线印制板：mulit-wiring printed board
32、 陶瓷印制板：ceramic substrate printed board
33、 导电胶印制板：electroconductive paste printed board
34、 模塑电路板：molded circuit board
35、 模压印制板：stamped printed wiring board
36、 顺序层压多层印制板：sequentially-laminated mulitlayer
37、 散线印制板：discrete wiring board
38、 微线印制板：micro wire board
39、 积层印制板：buile-up printed board
40、 积层多层印制板：build-up mulitlayer printed board (BUM)
41、 积层挠印制板：build-up flexible printed board
42、 表面层合电路板：surface laminar circuit (SLC)
43、 埋入凸块连印制板：B2it printed board
44、 多层膜基板：multi-layered film substrate(MFS)
45、 层间全内导通多层印制板：ALIVH multilayer printed board
46、 载芯片板：chip on board (COB)
47、 埋电阻板：buried resistance board
48、 母板：mother board
49、 子板：daughter board
50、 背板：backplane
51、 裸板：bare board
52、 键盘板夹心板：copper-invar-copper board
53、 动态挠性板：dynamic flex board
54、 静态挠性板：static flex board
55、 可断拼板：break-away planel
56、 电缆：cable
57、 挠性扁平电缆：flexible flat cable (FFC)
58、 薄膜开关：membrane switch
59、 混合电路：hybrid circuit
60、 厚膜：thick film
61、 厚膜电路：thick film circuit
62、 薄膜：thin film
63、 薄膜混合电路：thin film hybrid circuit
64、 互连：interconnection
65、 导线：conductor trace line
66、 齐平导线：flush conductor
67、 传输线：transmission line
68、 跨交：crossover
69、 板边插头：edge-board contact
70、 增强板：stiffener
71、 基底：substrate
72、 基板面：real estate
73、 导线面：conductor side
74、 组件面：component side
75、 焊接面：solder side
76、 印制：printing
77、 网格：grid
78、 图形：pattern
79、 导电图形：conductive pattern
80、 非导电图形：non-conductive pattern
81、 字符：legend
82、 标志：mark
[/size]
作者：ilww 2004-11-10 16:18:00)

二、 基材：
1、 基材：base material
2、 层压板：laminate
3、 覆金属箔基材：metal-clad bade material
4、 覆铜箔层压板：copper-clad laminate (CCL)
5、 单面覆铜箔层压板：single-sided copper-clad laminate
6、 双面覆铜箔层压板：double-sided copper-clad laminate
7、 复合层压板：composite laminate
8、 薄层压板：thin laminate
9、 金属芯覆铜箔层压板：metal core copper-clad laminate
10、 金属基覆铜层压板：metal base copper-clad laminate
11、 挠性覆铜箔绝缘薄膜：flexible copper-clad dielectric film
12、 基体材料：basis material
13、 预浸材料：prepreg
14、 粘结片：bonding sheet
15、 预浸粘结片：preimpregnated bonding sheer
16、 环氧玻璃基板：epoxy glass substrate
17、 加成法用层压板：laminate for additive process
18、 预制内层覆箔板：mass lamination panel
19、 内层芯板：core material
20、 催化板材：catalyzed board ,coated catalyzed laminate
21、 涂胶催化层压板：adhesive-coated catalyzed laminate
22、 涂胶无催层压板：adhesive-coated uncatalyzed laminate
23、 粘结层：bonding layer
24、 粘结膜：film adhesive
25、 涂胶粘剂绝缘薄膜：adhesive coated dielectric film
26、 无支撑胶粘剂膜：unsupported adhesive film
27、 覆盖层：cover layer (cover lay)
28、 增强板材：stiffener material
29、 铜箔面：copper-clad surface
30、 去铜箔面：foil removal surface
31、 层压板面：unclad laminate surface
32、 基膜面：base film surface
33、 胶粘剂面：adhesive faec
34、 原始光洁面：plate finish
35、 粗面：matt finish
36、 纵向：length wise direction
37、 模向：cross wise direction
38、 剪切板：cut to size panel
39、 酚醛纸质覆铜箔板：phenolic cellulose paper copper-clad laminates(phenolic/paper CCL)
40、 环氧纸质覆铜箔板：epoxide cellulose paper copper-clad laminates (epoxy/paper CCL)
41、 环氧玻璃布基覆铜箔板：epoxide woven glass fabric copper-clad laminates
42、 环氧玻璃布纸复合覆铜箔板：epoxide cellulose paper core, glass cloth surfaces copper-clad laminates
43、 环氧玻璃布玻璃纤维复合覆铜箔板：epoxide non woven/woven glass reinforced copper-clad laminates
44、 聚酯玻璃布覆铜箔板：ployester woven glass fabric copper-clad laminates
45、 聚酰亚胺玻璃布覆铜箔板：polyimide woven glass fabric copper-clad laminates
46、 双马来酰亚胺三嗪环氧玻璃布覆铜箔板：bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates
47、 环氧合成纤维布覆铜箔板：epoxide synthetic fiber fabric copper-clad laminates
48、 聚四乙烯玻璃纤维覆铜箔板：teflon/fiber glass copper-clad laminates
49、 超薄型层压板：ultra thin laminate
50、 陶瓷基覆铜箔板：ceramics base copper-clad laminates
51、 紫外线阻挡型覆铜箔板：UV blocking copper-clad laminates
作者：ilww 2004-11-10 16:19:00)

三、 基材的材料
1、 A阶树脂：A-stage resin
2、 B阶树脂：B-stage resin
3、 C阶树脂：C-stage resin
4、 环氧树脂：epoxy resin
5、 酚醛树脂：phenolic resin
6、 聚酯树脂：polyester resin
7、 聚酰亚胺树脂：polyimide resin
8、 双马来酰亚胺三嗪树脂：bismaleimide-triazine resin
9、 丙烯酸树脂：acrylic resin
10、 三聚氰胺甲醛树脂：melamine formaldehyde resin
11、 多官能环氧树脂：polyfunctional epoxy resin
12、 溴化环氧树脂：brominated epoxy resin
13、 环氧酚醛：epoxy novolac
14、 氟树脂：fluroresin
15、 硅树脂：silicone resin
16、 硅烷：silane
17、 聚合物：polymer
18、 无定形聚合物：amorphous polymer
19、 结晶现象：crystalline polamer
20、 双晶现象：dimorphism
21、 共聚物：copolymer
22、 合成树脂：synthetic
23、 热固性树脂：thermosetting resin
24、 热塑性树脂：thermoplastic resin
25、 感旋光性树脂：photosensitive resin
26、 环氧当量：weight per epoxy equivalent (WPE)
27、 环氧值：epoxy value
28、 双氰胺：dicyandiamide
29、 粘结剂：binder
30、 胶粘剂：adesive
31、 固化剂：curing agent
32、 阻燃剂：flame retardant
33、 遮光剂：opaquer
34、 增塑剂：plasticizers
35、 不饱和聚酯：unsatuiated polyester
36、 聚酯薄膜：polyester
37、 聚酰亚胺薄膜：polyimide film (PI)
38、 聚四氟乙烯：polytetrafluoetylene (PTFE)
39、 聚全氟乙烯丙烯薄膜：perfluorinated ethylene-propylene copolymer film (FEP)
40、 增强材料：reinforcing material
41、 玻璃纤维：glass fiber
42、 E玻璃纤维：E-glass fibre
43、 D玻璃纤维：D-glass fibre
44、 S玻璃纤维：S-glass fibre
45、 玻璃布：glass fabric
46、 非织布：non-woven fabric
47、 玻璃纤维垫：glass mats
48、 纱线：yarn
49、 单丝：filament
50、 绞股：strand
51、 纬纱：weft yarn
52、 经纱：warp yarn
53、 但尼尔：denier
54、 经向：warp-wise
55、 纬向：weft-wise, filling-wise
56、 织物经纬密度：thread count
57、 织物组织：weave structure
58、 平纹组织：plain structure
59、 坏布：grey fabric
60、 稀松织物：woven scrim
61、 弓纬：bow of weave
62、 断经：end missing
63、 缺纬：mis-picks
64、 纬斜：bias
65、 折痕：crease
66、 云织：waviness
67、 鱼眼：fish eye
68、 毛圈长：feather length
69、 厚薄段：mark
70、 裂缝：split
71、 捻度：twist of yarn
72、 浸润剂含量：size content
73、 浸润剂残留量：size residue
74、 处理剂含量：finish level
75、 浸润剂：size
76、 偶联剂：couplint agent
77、 处理织物：finished fabric
78、 聚酰胺纤维：polyarmide fiber
79、 聚酯纤维非织布：non-woven polyester fabric
80、 浸渍绝缘纵纸：impregnating insulation paper
81、 聚芳酰胺纤维纸：aromatic polyamide paper
82、 断裂长：breaking length
83、 吸水高度：height of capillary rise
84、 湿强度保留率：wet strength retention
85、 白度：whitenness
86、 陶瓷：ceramics
87、 导电箔：conductive foil
88、 铜箔：copper foil
89、 电解铜箔：electrodeposited copper foil (ED copper foil)
90、 压延铜箔：rolled copper foil
91、 退火铜箔：annealed copper foil
92、 压延退火铜箔：rolled annealed copper foil (RA copper foil)
93、 薄铜箔：thin copper foil
94、 涂胶铜箔：adhesive coated foil
95、 涂胶脂铜箔：resin coated copper foil (RCC)
96、 复合金属箔：composite metallic material
97、 载体箔：carrier foil
98、 殷瓦：invar
99、 箔（剖面）轮廓：foil profile
100、 光面：shiny side
101、 粗糙面：matte side
102、 处理面：treated side
103、 防锈处理：stain proofing
104、 双面处理铜箔：double treated foil
作者：ilww 2004-11-10 16:20:00)

四、 设计
1、 原理图：shematic diagram
2、 逻辑图：logic diagram
3、 印制线路布设：printed wire layout
4、 布设总图：master drawing
5、 可制造性设计：design-for-manufacturability
6、 计算机辅助设计：computer-aided design.(CAD)
7、 计算机辅助制造：computer-aided manufacturing.(CAM)
8、 计算机集成制造：computer integrat manufacturing.(CIM)
9、 计算机辅助工程：computer-aided engineering.(CAE)
10、 计算机辅助测试：computer-aided test.(CAT)
11、 电子设计自动化：electric design automation .(EDA)
12、 工程设计自动化：engineering design automaton .(EDA2)
13、 组装设计自动化：assembly aided architectural design. (AAAD)
14、 计算机辅助制图：computer aided drawing
15、 计算机控制显示：computer controlled display .(CCD)
16、 布局：placement
17、 布线：routing
18、 布图设计：layout
19、 重布：rerouting
20、 模拟：simulation
21、 逻辑模拟：logic simulation
22、 电路模拟：circit simulation
23、 时序模拟：timing simulation
24、 模块化：modularization
25、 布线完成率：layout effeciency
26、 机器描述格式：machine descriptionm format .(MDF)
27、 机器描述格式数据库：MDF databse
28、 设计数据库：design database
29、 设计原点：design origin
30、 优化（设计）：optimization (design)
31、 供设计优化坐标轴：predominant axis
32、 表格原点：table origin
33、 镜像：mirroring
34、 驱动文件：drive file
35、 中间文件：intermediate file
36、 制造文件：manufacturing documentation
37、 队列支撑数据库：queue support database
38、 组件安置：component positioning
39、 图形显示：graphics dispaly
40、 比例因子：scaling factor
41、 扫描填充：scan filling
42、 矩形填充：rectangle filling
43、 填充域：region filling
44、 实体设计：physical design
45、 逻辑设计：logic design
46、 逻辑电路：logic circuit
47、 层次设计：hierarchical design
48、 自顶向下设计：top-down design
49、 自底向上设计：bottom-up design
50、 线网：net
51、 数字化：digitzing
52、 设计规则检查：design rule checking
53、 走（布）线器：router (CAD)
54、 网络表：net list
55、 计算机辅助电路分析：computer-aided circuit analysis
56、 子线网：subnet
57、 目标函数：objective function
58、 设计后处理：post design processing (PDP)
59、 交互式制图设计：interactive drawing design
60、 费用矩阵：cost metrix
61、 工程图：engineering drawing
62、 方块框图：block diagram
63、 迷宫：moze
64、 组件密度：component density
65、 巡回售货员问题：traveling salesman problem
66、 自由度：degrees freedom
67、 入度：out going degree
68、 出度：incoming degree
69、 曼哈顿距离：manhatton distance
70、 欧几里德距离：euclidean distance
71、 网络：network
72、 阵列：array
73、 段：segment
74、 逻辑：logic
75、 逻辑设计自动化：logic design automation
76、 分线：separated time
77、 分层：separated layer
78、 定顺序：definite sequenc
作者：ilww 2004-11-10 16:21:00)

五、 形状与尺寸：
1、 导线（信道）：conduction (track)
2、 导线（体）宽度：conductor width
3、 导线距离：conductor spacing
4、 导线层：conductor layer
5、 导线宽度/间距：conductor line/space
6、 第一导线层：conductor layer No.1
7、 圆形盘：round pad
8、 方形盘：square pad
9、 菱形盘：diamond pad
10、 长方形焊盘：oblong pad
11、 子弹形盘：bullet pad
12、 泪滴盘：teardrop pad
13、 雪人盘：snowman pad
14、 V形盘：V-shaped pad
15、 环形盘：annular pad
16、 非圆形盘：non-circular pad
17、 隔离盘：isolation pad
18、 非功能连接盘：monfunctional pad
19、 偏置连接盘：offset land
20、 腹（背）裸盘：back-bard land
21、 盘址：anchoring spaur
22、 连接盘图形：land pattern
23、 连接盘网格阵列：land grid array
24、 孔环：annular ring
25、 组件孔：component hole
26、 安装孔：mounting hole
27、 支撑孔：supported hole
28、 非支撑孔：unsupported hole
29、 导通孔：via
30、 镀通孔：plated through hole (PTH)
31、 余隙孔：access hole
32、 盲孔：blind via (hole)
33、 埋孔：buried via hole
34、 埋/盲孔：buried /blind via
35、 任意层内部导通孔：any layer inner via hole (ALIVH)
36、 全部钻孔：all drilled hole
37、 定位孔：toaling hole
38、 无连接盘孔：landless hole
39、 中间孔：interstitial hole
40、 无连接盘导通孔：landless via hole
41、 引导孔：pilot hole
42、 端接全隙孔：terminal clearomee hole
43、 准表面间镀覆孔：quasi-interfacing plated-through hole
44、 准尺寸孔：dimensioned hole
45、 在连接盘中导通孔：via-in-pad
46、 孔位：hole location
47、 孔密度：hole density
48、 孔图：hole pattern
49、 钻孔图：drill drawing
50、 装配图：assembly drawing
51、 印制板组装图：printed board assembly drawing
52、 参考基准：datum referan